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A 0.18μm CMOS 1000 frames/sec, 138dB Dynamic Range Readout Circuit for 3D-IC IR Focal Plane Arrays
CMOS 1000 frames/sec Dynamic Range Readout Circuit 3D-IC IR Focal Plane Arrays
2015/8/17
A prototype of a new high dynamic range readout scheme targeted for 3D-IC IR focal plane arrays is described.Dynamic range is extended using synchronous self-reset while high SNR is maintained using f...
10-Gb/s - 80-km operation of full C-band InP MZ modulator with linear-accelerator-type tiny in-line centipede electrode structure directly driven by logic IC of 90-nm CMOS process
Waveguide modulators Traveling-wave devices
2015/5/21
InP MZ modulator of sub 1-V pp driving voltage with quasi-traveling-wave electrode structure and Logic IC of 90-nm CMOS process as its driver were developed. Their applicability was demonstrated throu...
Symmetric 10G-EPON ONU transceiver integrated with newly-developed burst-mode pre-bias timing control IC
Networks Optical communications
2015/6/4
We developed symmetric 10G-EPON ONU transceiver fully compliant with IEEE802.3av PR30.Output power of +5dBm, sensitivity of -32.4dBm, and fast LD turn-on/off time of 10ns/7ns were successfully achieve...
Hybrid Co-Packaged Receiver Module with pin-Photodiode Chip and DEMUX-IC for 107 Gb/s Data Rates
Receiver Module pin-Photodiode Chip DEMUX-IC Data Rates
2015/7/20
A hybrid co-packaged receiver with pin-photodetector and DEMUX-IC for 107 Gb/s is presented. Well opened demultiplexed eye diagrams at 53.5 Gb/s for 107 Gb/s input and error-free demultiplexing perfor...
A 82.5-GSample/s (10.3125-GHz x 8 phase-shifted clocks) sampling IC for 10G-EPON burst-mode CDR
phase-shifted clocks IC 10G-EPON burst-mode CDR
2015/7/17
New very high-speed 82.5-GS/s sampling IC and its incorporated burst-mode CDR compliant for 10G-EPON is presented. The 82.5-GS/s sampling CDR successfully achieved a high pulse-width distortion tolera...
一种用于功率IC中高性能PNP管的版图设计
PNP管 功率IC
2009/7/15
在对传统横向PNP管版图和晶体管寄生效应分析的基础上，提出了一种基于双极工艺的横向PNP管设计方案，并给出了一个适用于功率集成电路中高性能横向PNP输出管的版图设计.
表面贴装IC全自动激光打标切筋成形一体机开发
激光打标 切筋成形 集成电路
2008/10/20
该机是一台为集成电路作商标标记并切筋成形的全自动生产设备，集机、电、光于一体，由全自动集成电路激光打标机和自动切筋成形机及连接过渡装置组成，分为激光打标全自动输送及定位系统、激光精密快速双头标刻系统和切筋成形系统三大部分，采用PLC和计算机控制，实现从供卸料、上下料、输送、定位、打标、切筋、成形、分离、装管等全自动生产。对于商标标记和切筋成形工作，既可单机生产，又可联机生产，满足不同生产的需要；在...
Demonstration of 10.3-Gbit/s Burst-mode CDR employing 0.13 um SiGe BiCMOS Quad-rate sampling IC and Data-phase decision-algorithm for 10Gbps-based PON Systems
Burst-mode CDR SiGe BiCMOS Quad-rate sampling IC Data-phase decision-algorithm PON Systems
2015/8/6
We present a new 10Gbps-based PON burst-mode CDR with a 0.13 um BiCMOS quad-rate sampling IC and decision-algorithm for optimum recovery-data selection.Instantaneous burst-mode recovery of the first b...
43 Gbit/s EAM-LD Module with Built-in Driver IC Employing Novel Cathode-Floating Bias Circuit
EAM-LD Module Driver IC Employing Novel Cathode-Floating Bias Circuit
2015/7/31
A novel design of cathode-floating bias circuit realizes 43 Gbit/s EAM-LD module with mask margin of 16 %, and cooler power consumption of 0.5 W.
上海光机所IC装备零部件研究取得多项重要进展
2008/1/21
为满足我国IC装备零部件国产化要求，在上海市科学技术委员会的支持下，近期，上海光机所“光刻机定位双频激光干涉仪”、“硅片缺陷自动检测仪”与 “激光光刻用准分子激光系统部分关键技术”研究取得重要进展。“光刻机定位双频激光干涉仪”项目由程兆谷研究员、黄惠杰研究员课题组开展。通过3年的研究，取得6项专利，并在完成关键技术攻关和原理性实验工作的基础上，研制出双频激光干涉仪样机。验收专家认为“该项目研制成功...